INNOVATIONS IN
FULL DUPLEX
TECHNOLOGIES
SIMULTANEOUS, SINGLE-CHANNEL TRANSMIT AND RECEIVE TECHNOLOGY DOUBLES THROUGHPUT AND MAXIMIZES SPECTRAL EFFICIENCY ESSENTIAL TO 5G
ENABLING COMPUTING AT THE SPEED OF LIGHT
We're Developing Disruptive Silicon Photonic Solutions for 100GB Data Transfer Rate and Beyond.
BUSINESS AT THE SPEED OF LIGHT - MADE IN AMERICA
VEO Photonics, A COMSoverign Company, is developing processes that will significantly advance the state-of-the-art in Silicon Photonic devices for use in advanced data interconnects, communication networks, and computing systems. Specifically, VEO Photonics' novel approach allows for overcoming the limitations of current SiP modulators, and hence can dramatically increase computing bandwidth and reduce drive power while offering lower operating costs.
VEO Photonics owns intellectual property (IP) including patents protecting its novel methods and designs. VEO’s current development efforts include independent R&D, as well as projects in conjunction with leading academic institutions.
BUSINESS OVERVIEW
The emerging field of Silicon Photonics (SiP) is poised to revolutionize chip-to-chip connectivity. SiP offers high-confinement and low-loss optical waveguides, replacing traditional wired lines which are impaired by electro-magnetic interference and large frequency tilt loss over long distances.
Fiber-optics enable a much larger information carrying capacity than electrical interconnects. Today fiber-optics are used to replace copper cables as the primary means of transmitting high-speed data, however there is always an acute need for a “higher” speed optical transmitter that can overcome one of the fundamental bottlenecks that limit the bandwidth of fiber-based communication.
Traditional solutions such as direct-modulated laser diodes are bandwidth limited up to 28GBaud. III-V electro-absorption modulators, the other promising approach, is indeed capable of operating at rates up to 53GBaud but with a severe penalty of higher manufacturing cost. SiP, leveraging the already established capabilities of the CMOS industry, is a promising solution towards wafer integration of optics and electronics to realize practical manufacturing costs. However, current commercial silicon modulators are limited to a rate of up to 28GBaud.
Ultra-high Rate Optical Data Center/Chip-to-Chip Interconnect
Problem: Current infrastructure is struggling to keep up with increasing demand in data rates:
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Copper reaches limitations at 25Gb/s/lane at 50cm distance, but new chip-to-chip applications require lane rates in excess of 100Gb/s.
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Datacenters and Metro Optical Networks: These require faster modulators that can exceed 100 Gbps on one wavelength with low cost silicon solutions. Modulators need to quadruple in speed in the next 2-3 years.
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Mobile devices: Mobile device hardware designers will need to upgrade the speed of chip-to-chip connectivity from 10Gbps to beyond 100 Gbps with the rise of 5G wireless technology. In the next few years, copper lines need to be replaced with low cost integrated optical lines.
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Future real-time platforms (such as VR/AR, autonomous cars): These require low latency integrated optical connectivity solutions with several 100s of Gbps speed.
All of these market applications require high speed, low-cost optical connections.
VEO Photonics' solutions significantly relieve current silicon-based modulator performance bottlenecks, increasing bandwidth and reducing electrical drive power. The performance factor of a traditional silicon modulator (by speed, power consumption, and optical loss) can increase by 4 times via advanced lithography technique. Alternatively, using a novel CMOS compatible process, the performance factor can leapfrog by up to 20 times.
It is patently evident that SiP has become the expected next revolution in computing.
Silicon Photonics (SiP) is the study and application of photonic systems which use silicon as an optical medium. Over the past two decades, silicon photonics has become one of the leading photonic integrated circuit (PIC) technologies owing to its promises for large-scale integration, low-cost and high-volume productions.
SiP also will have an important key role supporting computer communications. Progress in computer technology is becoming increasingly dependent on faster data transfer between and within microchips. Optical interconnects provide a way forward, and silicon photonics will be particularly useful, once integrated on standard silicon chips. In 2006 Former Intel senior vice president Pat Gelsinger stated that, “Today, optics is a niche technology. Tomorrow, it's the mainstream of every chip that we build.”
It is patently evident that SiP has become the expected next revolution in computing. Copper traces in silicon chips have reached their limit in bandwidth and speed. With SiP, the future of light computing’ has arrived. Computer chips will soon communicate literally at the speed-of-light and with bandwidth and data capacities that are beyond what our imaginations dreamed of a decade ago. The leader in these developments will reap enormous benefits.
VEO owns intellectual property (IP) including patents protecting its novel methods and designs. VEO’s current development efforts include independent R&D, as well as projects in conjunction with leading academic institutions.
LEADERSHIP
DUSTIN H. MCINTIRE, Phd • CHIEF EXECUTIVE OFFICER
In addition to the CEO of VEO Photonics, Dr. McIntire serves as the Chief Technology Officer for its parent company COMSovereign. He is an electrical design engineer with more than 20 years of experience designing hardware and software for embedded and consumer electronics, wireless communications systems, and the Internet of Things. He has acute, broad area expertise over several emerging technology fields. His history includes successfully leading projects and teams from concept through production utilizing extensive background in computer architecture, low power circuits, embedded software, and communications protocols. Companies Dr. McIntire he has led as either a Chief Technologist, CTO, or CEO include Tranzeo Wireless, Arrayent, Prodea, and Silver-Bullet Technology. He holds a B.S. from Stanford, and M.S. and Ph.D. degrees in Electrical Engineering from UCLA.
CHEN KUO “CK” SUN, PhD • CHIEF TECHNOLOGY OFFICER
CK develops high performance optical transceivers using technologies that address current needs in the existing and upcoming billion- dollar data-com and telecom markets, as well as the exploding chip-to-chip optical interconnection market. Prior to VEO Photonics, he was the CTO of Integra R&D in charge of developing 4x25Gb laser diode driver chip, using ADP technology in optical transceiver application. Dr. Sun is highly innovative and is interested in challenging the boundaries of the technological field. He served as CTO for TiOptics and Titan Photonics in the technology development for CATV and telecom transceiver markets. He also founded and was Chief Engineer of Lightwave Solutions, which focused on a novel optical linearization technology for optical transmission. It was acquired by Cisco in 2007. He holds 21 patents in the field of high-speed photonics technology. He obtained his Ph.D. in Electrical Engineering from UCSD.
CORPORATE OWNERSHIP
CONNECTING TOMORROW
VEO Photonics is owned by COMSovereign Holding Corp., a Dallas based Telecom Infrastructure Company.
COMSovereign will be the AMERICA MADE PATH TO 5G and BEYOND!
STOCK SYMBOL - "COMS"
JOBS
Submit resumes in PDF format to jobs@comsovereign.com
OPEN POSITIONS
Semiconductor Process Engineer
VEO Photonics, a COMSovereign Company, is seeking experienced semiconductor process engineer. Ideal candidate has wide breadth of experience and is flexible to work independently or collaboratively. Expect 30%-50% of time performing hands-on work in cleanroom. This position will be based in San Diego.
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Semiconductor process integration & module development for manufacturing
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Optoelectronic package mechanical design, drafting & Assembly process development
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Hands-on semiconductor micro- or nano-fabrication
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Semiconductor manufacturing tool operation
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Package prototyping including fiber attach, die attach, and component bonding
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Debug die and component level chip-package interactions
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FMEA, DOE, and problem solving
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Reliability testing & Stress/shock analysis
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Supplier coordination/management
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New product introduction & yield enhancement
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B.S. Engineering and 10+ years relevant experience required. M.S. preferred.
Submit resumes in PDF format to jobs@comsovereign.com